The polyimide fluoropolymer film is made of all kinds of polyimide film and fluoroplymer, in order to meet functional properties, such as thermal conductivity, corona resistance, high-abrasion, high-temperature, more thinner, etc.
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Polyimide FEP film (Kymide KYPIFEP) is polyimide film coated with FEP resin on one side or double sides through the sintering process at high temperature, which combines the excellent properties of polyimide film and FEP resin, high& low temp resistant, radiation resistant, excellent electrical properties, superior dimensional stability and heat sealable properties.
Polyimide FCR film (KYPIFCR) is CR type polyimide film with corona resistant property, coated with FEP resin on one side or double sides through the sintering process at high temperature, which combines the excellent properties of CR type polyimide film and FEP resin. Besides the properties of KYPIFEP, this film exhibits corona resistance.
KYPIFHR is polyimide film coated with high-temp resistant fluoropolymer on one side or double sides through the sintering process at high temperature, which combines the excellent properties of polyimide film and fluoropolymer, high& low temp resistant, radiation resistant, excellent electrical properties, superior dimensional stability and heat sealable properties. It can resist higher temperature than general purpose type KYPIFEP, with 240°C.
KYPIFAR is polyimide film with fluoropolymer, which exhibits higher scrape abrasion resistance, electrical and physical properties, which is a more ideal choice for magnet wire for down-hole pumps where higher scrape abrasion resistance is required.
KYPIF502 is pigmented polyimide film with fluoropolymer resin, with the best combination properties of polyimide film and fluroplastic polymer. There are all kinds of color, Red, Green, Blue, Black, White etc. It is an ideal material for wire and cable where color identification is required .
KYPIFMT is thermally conductive polyimide film coated with fluoropolymer resin with double sides through the sintering process at high temperature, which combines the excellent properties of thermally conductive polyimide film and FEP resin, posses heat sealable properties, excellent thermal conductivity, and provide an ideal heat conduction and control programs to high-intensity electronic integrated components.